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Tejashree Kanake bir ses eklendi Other
2026-11-02 12:03:43 ·
High-Vacuum Thin-Film Metallization In The Wafer Used PVD Equipment Market
The ongoing dimensional scaling of front-end semiconductor devices, coupled with the rapid expansion of 2.5D/3D heterogeneous packaging and wide-bandgap power electronics, has placed rigorous demands on thin-film deposition technologies. Modern integrated circuits require ultra-thin, highly uniform metallic and dielectric coatings to establish interconnect metallization, barrier layers, seed...
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